Call for Papers: Special Issue on Chip Design 2020
IEEE Micro seeks submissions for this special issue.

Submissions due: 27 April 2020

Publication: November/December 2020

With slowing down of the dimensional scaling in advanced CMOS technologies coupled with the rise of custom hardware accelerators for energy-efficient computing in a variety of AI/ML, AR/VR applications, integrated circuits (ICs) are transforming rapidly to meet the power, performance, security, and connectivity demands of such systems and architectures. This special issue of IEEE Micro aims at publishing some of the most significant research that can highlight the trends in IC design in 2020 and provide directions for the future IC design era. The scope of the paper submissions is very broad to cover many aspects of modern IC designs, including but not limited to state-of-the-art chip design in 2020 and challenges in:

  • Lithography/process
  • Novel logic and memory devices
  • 3D integration methodologies
  • EDA methodologies (verification, test, physical design)
  • Hot, Cool, and Unique Chips in 2020
  • Custom mixed signal and RF circuits
  • Neural network (DNN, SNN) accelerators

Submissions due: April 27, 2020
Initial notifications: June 29, 2020
Revised papers due: August 3, 2020
Final notifications: September 7, 2020
Final versions due: September 19, 2020
Publication date: Nov/Dec 2020

Submission Guidelines

Articles should be no more than 5,000 words including figures, each of which counts as 250 words. Submit electronically through ScholarOne Manuscripts, selecting this special-issue option. Article templates are not required, but can be found here. Other author information regarding article preparation and submission can be found here.

Questions?

Contact the guest editor, Jaydeep Kulkarni (jaydeep@austin.utexas.edu), or the editor-in-chief, Lizy K. John (ljohn@ece.utexas.edu).

Special Issue on Chip Design 2020
27 April 2020